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FPD/PCB NEWS`November 7
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The test was conducted from October 19 to 22, 2023 at the AGC Yokohama Technical Center's figured glass production furnace. For the recovery of glass from solar panels, the test used the heat treatment technology of the commercial solar panel recycling production line of Mitsubishi Chemical Group company Shinryo Corporation. In this demonstration test, it was confirmed that solar panel cover glass can be turned into raw material cullet that can be reused for flat glass production through a special heat treatment. This will reduce industrial waste and conserve raw materials derived from natural resources such as silica sand and soda ash, thereby contributing to the promotion of the circular economy. |
FPD/PCB NEWS`October 13
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This technology enables patterning with a minimum linewidth of 14 nm, equivalent to the 5-nm-node required to produce most advanced logic semiconductors which are currently available. Furthermore, with further improvement of mask technology, it is expected to enable circuit patterning with a minimum linewidth of 10 nm, which corresponds to 2-nm-node. |
FPD/PCB NEWS`October 12
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FPD/PCB NEWS`October 3
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The organization, which is being re-named FUJIFILM Electronic Materials Process Chemicals, is part of Fujifilm's growth strategy to further position the business as a leader in semiconductor materials manufacturing. |
FPD/PCB NEWS`August 31
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FPD/PCB NEWS`‚iuly 6
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An ED is a disk onto which fine scales have been engraved. Mounted inside the encoder, various sensors detect reflected light on, or transmitted through, the disk, and by converting this into electrical signals detect and control whether industrial robots are moving and rotating in the correct manner. As factory automation has progressed in recent years, there has been increased demand for encoders capable of detecting the movement and rotation of robot motors. In response to this situation, DNP has decided to enter the development and manufacturing of ED. The company will combine proprietary strengths in precision thin film coating and patterning technology cultivated in connection with the development of a variety of display products. |
FPD/PCB NEWS`‚iune 27
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This time, a pair of burners developed by Taiyo Nippon Sanso to prevent a rapid rise in flame temperature through multi-stage combustion were installed in the glass melting furnace (actual production furnace) used to produce architectural glass at the AGC Yokohama Technical Center, and the world's first demonstration test using ammonia as fuel was conducted for two days from June 18 to 19th, 2023. In the demonstration test, compared with conventional combustion methods using heavy oil as fuel under various conditions, the effects on the quality of glass, furnace materials, and control of the flame temperature, furnace temperature, and NOx emissions were verified. In this test, the NOx concentration in the exhaust gas was found to be below the environmental criterion value while maintaining the required temperature of the glass melting furnace. |
FPD/PCB NEWS`‚iune 13
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In this latest development, DNP introduced a new coating device capable of accommodating a 2,500 mm width as a second manufacturing line. As a result, the production capacity, on an area basis, has increased by more than 15%. The newly added wide-width coating equipment is designed to be able to coat two layers at the same time. As displays become more sophisticated and diversified in the future, multi-layered coatings will become necessary, and DNP will continue to meet the demand for Anti-glare-Low Reflection (AG-LR) film and Low Reflection (LR) film. |
FPD/PCB NEWS`‚iune 2
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PCAS Canada has since been renamed gInnovation DIC Chimitroniquesh. Looking forward, DIC will work to expedite the company's development of products for cutting-edge processes, make capital investments to strengthen its supply capabilities, and create a corporate organization suited to the needs of DIC Group customers in both North America and Asia. Through these efforts, DIC will continue to supply materials that underpin the growth and evolution of the semiconductor industry. |