Explain oxide-TFT-LCD Manufacturing process by illustration
Full-cover from basic process to next generation process

Explain TFT structure, and process flow of TFT array, CF array, LC cell, and module assemble.
Cover 3D technology of with and without glass method

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Possible to access at will from Index Page to detail page
Describe these illustrations at 3D image

Number of total file are 123 (about 240 page in A4 form equivalent)
Illustrations of device structure and process flow are approximately 420.

■Structure of oxide-TFT-LCD
Orientation and feature of oxide TFT
Categorization of oxide TFTs
The top gate type
　 The conventional type
　 The self-align type

The bottom gate type
　 The etch-stopped type
　 The back-channel-etched type
　 The self-align type

The dual gate type

■Oxide-TFT array process
　 Forming process of gate electrode
　 Forming process of gate insulator film
　 Forming process of oxide semiconductor layer
　　 Structure of oxide semiconductor layer
　　 Deposition process of oxide semiconductor layer
　　 Patterning process of oxide semiconductor layer
　　 Direct printing of oxide semiconductor layer
　 Forming process of etch-stopped layer
　 Forming process of S/D
　 Forming process of passivation layer (＋ planarization layer) and contact hole　Anneal treatment
　 Forming process of pixel electrode
　　 In case of use of inorganic transparent pixel electrode
　　 In case of use of wettable material
　　 Forming process of source/drain area
　　 Forming process of top gate electrode

■CF (Color filter) forming process
Manufacturing process of CF for IPS mode/FFS mode TFT-LCD
Manufacturing process of CF for VA mode TFT-LCD
Manufacturing process of CF for TN/OCB mode TFT-LCD
Black matrix forming process
Manufacturing process of R, G, B color layer
Manufacturing process of overcoat layer
Deposition process of opposite electrode
Manufacturing process of post-spacer
Manufacturing process of rib (bump)
Photo-alignment process (for MVA mode TFT-LCD)

■LC cell process
Polyimid coating process
Alignment process
Seal layer forming process
Dispersion process of spacer-ball
Making panel thinner process
Scribe and break process
Filling process of LC material
ODF (One drop fill) process

■Module assemble process
Connect panel and driver-IC

■Liquid crystal material and display mechanism

■Structure of backlight module
Side light type
　 Light guide plate technology
Structure of direct type
　 LED backlight for TV (Direct type, side light type)

■Liquid crystal material and display mechanism

■3D technology
Method to use a specific glasses
　 LC shutter glasses method (Time sequential method)
　 Polarized glasses ＋ patterned phase difference film (Space division method)

Specific glasses-free method
　 Parallax barrier method
　 Parallax barrier using dual emission OLED
　 Time sequential driving ＋ parallax LC barrier method
　 Lenticular lens method
　 Time sequential twin-lens 3D-OCB method
　 Lenticular ＋ time sequential scanning backlight method

▲TFT structure

▲Self-alignment exposure process of the etch-stopped type TFT

▲Structure of IGZO semiconductor layer

▲3D technology (Parallax barrier using dual emission OLED)

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