Explain LTPS (Low temperature poly-Si) TFT-LCD Manufacturing process by illustration
Full-cover from basic process to next generation process

Explain TFT structure, and process flow of TFT array, CF array, LC cell, and module assemble.
Cover process flow of circuit area in addition to that of pixel area
Describe these illustrations at 3D image
Cover TFT structure of LDD, GOLDD, Dual Gate, and CLDD

Easy to look at the file using any PC because of the format of browser, for example IE (Internet Explorer)
Possible to access at will from Index Page to detail page
Number of total file are 56 (about 120 page in A4 form equivalent)
Illustrations of device structure and process flow are approximately 260.

■Structure of LTPS-TFT-LCD
�@Single drain structure (SD)
�ADual Gate structure
�BLDD (Lightly Doped Drain) structure
�CGOLDD (Gate Overlapped LDD) structure
�DCLDD (Compound LDD) structure

■Crystallization process

■TFT array process
�@Single drain structure (SD)
�ALDD (Lightly Doped Drain) structure
�BGOLDD (Gate Overlapped LDD) structure
　 Forming process of poly-Si
　 Forming process of TFT area (PEP1)
　 Batch forming process of S/D in TFT area and N-channel (PEP1)
　 High concentration P doping process (PEP2)
　 Forming process of gate electrode and capacitor electrode (PEP3)
　 P-TFT High concentration N doping process (PEP4)
　 Forming process of contact hole (PEP5)
　 Forming process of data line (PEP6)
　 Hydrotreatment, form passivation and planarization layer (PEP7)
　 Manufacturing process of pixel electrode (PEP8)
　 P-TFT ion doping process
　 N-TFT ion doping process

■CF (Color filter) forming process
　 Manufacturing process of CF for IPS mode/FFS mode TFT-LCD
　 Manufacturing process of CF for VA mode TFT-LCD
　 Manufacturing process of CF for TN/OCB mode TFT-LCD
　　 Black matrix forming process
　　 Manufacturing process of R, G, B color layer
　　 Manufacturing process of overcoat layer
　　 Deposition process of opposite electrode
　　 Manufacturing process of post-spacer
　　 Manufacturing process of rib (bump)
　　 Photo-alignment process (for MVA mode TFT-LCD)

■LC cell process
　 Polyimid coating process
　 Alignment process
　 Seal layer forming process
　 Dispersion process of spacer-ball
　 Making panel thinner process
　 Scribe and break process
　 Filling process of LC material
　 ODF (One drop fill) process

■Module assemble process
　 Connect panel and driver-IC

■Liquid crystal material and display mechanism

■Structure of backlight module

■3D technology
Method to use a specific glasses
　 LC shutter glasses method (Time sequential method)
　 Polarized glasses ＋ patterned phase difference film (Space division method)

Specific glasses-free method
　 Parallax barrier method
　 Parallax barrier using dual emission OLED
　 Time sequential driving ＋ parallax LC barrier method
　 Lenticular lens method
　 Time sequential twin-lens 3D-OCB method
　 Lenticular ＋ time sequential scanning backlight method

Detail of material and system is explained

▲TFT structure

▲Crystallization process

▲Half-tone process

While you order this CD-ROM, please input below points and send to info@e-express.co.jp.

CD-ROM： LTPS-TFT-LCD manufacturing process
Campany's Name：
Section：
Name：
Address：
TEL：
FAX：
e-mail address：
Media：CD-ROM or USB memory (Please erase CD-ROM or USB memory.)

Remark

If you are domestic customer, we will send the product and invoice. Please pay to ours account by bank remittance until specified date.

If you are overseas customer, we will send E-mail to you. Please pay to ours account by bank remittance. If we confirm bank transfer, we send the product immediately.